Figure 1 - Block Diagram Black: common for all versions, Blue: additional pins / functionality for MLX81207, Blue + red: additional pins / functionality for MLX81210 / MLX81215 Product Abstract TFR / CPA Page 5 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 2. Pin Description Name VS RTG VDDA V5R V5IN VDDD GNDD GNDCAP GNDDRV GNDA LIN IOHV TI0 TI1 TO OSC1 OSC2 IO1 IO2 IO3 IO4 IO5 IO6 IO7 IO8 IO9 CLKO SHU SHV SHW T VREF CP2 HS2 W LS2 CP1 HS1 V LS1 CP0 HS0 U LS0 VBAT_S1 VBAT_S2 Type P O P P I P GND GND GND GND HVIO HVIO I I O I O LVIO LVIO LVIO LVIO LVIO LVIO LVIO LVIO LVIO HVO HVI HVI HVI HVI P HVIO HVIO HVI HVO HVIO HVIO HVI HVO HVIO HVIO HVI HVO HVI HVI Function Battery Supply 3.3V External MOS Gate Control 3.3V Supply 5V Regulator Output for external NFET 5V Regulator Input 1.8V Regulator output Digital ground Digital ground Driver ground Analog ground Connection to LIN bus or PWM interface General purpose IO pin Test input, debug interface Test input, debug interface Test output, debug interface Quarz interface input Quarz interface ouput General purpose IO pin (Low voltage 3.3V) General purpose IO pin (Low voltage 3.3V) General purpose IO pin (Low voltage 3.3V) General purpose IO pin (Low voltage 3.3V) General purpose IO pin (Low voltage 3.3V) General purpose IO pin (Low voltage 3.3V) General purpose IO pin (Low voltage 3.3V) General purpose IO pin (Low voltage 3.3V) General purpose IO pin (Low voltage 3.3V) Switchable 250kHz clock output to VREF level Phase U input to BEMF sensing blocks Phase V input to BEMF sensing blocks Phase W input to BEMF sensing blocks Reference input to BEMF sensing blocks Clamped 8V or 12V ref. voltage for bootstrap High side bootstrap capacitor driver 2 N-FET high side gate driver 2 Phase W input to HS2 buffer and BEMF sensing blocks N-FET low side gate driver 2 High side bootstrap capacitor driver 1 N-FET high side gate driver 1 Phase V input to HS1 buffer and BEMF sensing blocks N-FET low side gate driver 1 High side bootstrap capacitor driver 0 N-FET high side gate driver 0 Phase U input to HS0 buffer and BEMF sensing blocks N-FET low side gate driver 0 VS high side input for current sensing VS low side input for current sensing MLX81205 X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X MLX81207 X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X MLX81210 X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X MLX81215 X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X Product Abstract TFR / CPA Page 6 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 GND_S1 GND_S2 Pin count LVI LVI GND high side input for current sensing GND low side input for current sensing 32 37 X X 48 X X 48 Table 3 - Pin Description MLX81205 / MLX81207 / MLX81210 / MLX81215 3. Electrical Characteristics All voltages are referenced to ground (GND). Positive currents flow into the IC. The absolute maximum ratings given in the table below are limiting values that do not lead to a permanent damage of the device but exceeding any of these limits may do so. Long term exposure to limiting values may affect the reliability of the device. Reliable operation of the MLX81205/07/10/15 is only specified within the limits shown in Operating conditions. 3.1 Operating Conditions Parameter IC supply voltage Operating ambient temperature Symbol VS Tamb Table 4 - Operating Conditions Min 5 -40 Max 18 +150 [1] Unit V °C Target temperature specification after qualification. With temperature applications at TA>125°C a reduction of chip internal power dissipation with external supply transistor is mandatory. The extended temperature range is only allowed for a limited period of time, customer’s mission profile has to be agreed by Melexis as a mandatory part of the Part Submission Warrant. [1]3.2 Absolute Maximum Ratings Parameter IC supply voltage Maximum reverse current into any pin Maximum sum of reverse currents into all pins DC voltage on LVIO pins, OSC<2:1>, GND_S<2:1> DC voltage on HV I/O pin, V5R pin DC voltage on drivers supply pin VREF DC voltage on drivers control pins (CLKO, LS<2:0>) DC voltage on drivers CP<2:0>, HS<2:0> pins DC voltage on phases related pins (U, V, W, SHU, SHV, SHW, T, VBAT_S<2:1>) ESD capability of pin LIN ESD capability of any other pins Maximum latch–up free current at any Pin Junction temperature [1] Storage temperature Rthjc QFN32 Rthjc QFN48 Rthjc TQFP48 Symbol Condition VS T = 2 min T < 500 ms Human body model, equivalent to Human body model, equivalent to discharge 100pF with 1.5kΩ, Min -0.3 -10 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -6 -2 -250 -55 Max 28 45 +10 +10 VDDA+0.3 VS+0.3 18 VREF+0.3 VS + VREF VS+1.5 +6 +2 +250 +155 +150 10 5 5.5 Unit V mA mA V V V V V V kV kV mA °C °C K / W K / W K / W ESDBUSHB discharge 100pF with 1.5kΩ, ESDHB ILATCH Tvj Tstg Rthjc Table 5 - Absolute Maximum Ratings Product Abstract TFR / CPA Page 7 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 [1] Target temperature specification after qualification. With temperature applications at TA>125°C a reduction of chip internal power dissipation with external supply transistor is mandatory. The extended temperature range is only allowed for a limited period of time, customer’s mission profile has to be agreed by Melexis as a mandatory part of the Part Submission Warrant. 4. Application Examples The following sections show typical application examples[1]. 4.1 Sensor-less BLDC Motor Control on the LIN-Bus or via PWM-Interface with reverse polarity protection and current sensing In the sample application of Figure 2, the MLX81205 can realize the sensor-less driving of a BLDC motor via three external power N-FET half bridges with only a few external components. The high side N-FET driving is done with a bootstrap output stage. Reverse polarity protection of the bridge is realized with an external power FET in the ground path. An external temperature sensor is connected to the 10 bit ADC via pin IO1. The integrated watchdog with a dedicated separate RC-oscillator is monitoring application integrity. The communication interface could be LIN or a PWM interface. The pin LIN can also be used as wake-up source and to program the Flash memory. The motor currents are measured by a shunt resistor in the high side path. In case the current exceeds the programmed threshold, the bridge can be switched off automatically and / or a software interrupt can be generated. The motor current can also be measured by the 10-bit ADC converter. The patented Melexis TruSense technology combines two methods to determine the rotor position: - The measurement of the induced BEMF voltage at medium and high speeds. - The measurement of position dependent coil inductance variations at stand-still and low speeds. As a result TruSense allows operation of the motor in the widest dynamic speed range. The motor can be driven with block, trapezoidal or sine-wave currents. The motor start-up can be made independent of the load conditions according to the application requirements. In this example application the motor star point is not available. It is modeled with external resistors from the motor phases and connected to T input. Alternatively an artificial IC internal reference point can be chosen as shown in the block diagram of the MLX81205/07/10/15. The application examples are principal application schematics only. The details need to be worked out for each application schematic separately, depending on the application requirements. [1] Product Abstract TFR / CPA Page 8 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 Product Abstract TFR / CPA Page 9 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 4.2 Sensor-less BLDC Motor Control on the LIN-Bus or via PWM-Interface with reverse polarity protection in the high side path In the sample application of Figure 3, the MLX81207 has been selected in order to benefit from the external high side reverse polarity protection possibility compared to the application shown in section 4.1. All other remarks from the previous application example remain valid. Figure 3 – Typical Sensor-less BLDC Motor Control Application Example with MLX81207 Product Abstract TFR / CPA Page 10 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 4.3 Sensor based BLDC Motor Control In the sample application of, Figure 4, the MLX81207 can realize the driving of a BLDC motor with three Hall sensors. An external P-FET is used to derive the 3.3V supply with a higher current capability in order to bring power consumption outside the MLX81207. VBAT VSCLKOVHIGHVBAT_S1SHUNTVBAT_S2VREFCP2VPROTVCC3RTGVDDAVDDDCP1CP0VCC3IO1LIN / PWMLINHS0UULS0IO2MLX81207HS1VPROTIO3IOHVOSC1VVLS1VPROTHS2OSC2IO4IO5WWLS2TI0TI1TOGNDAGNDDGNDCAPGNDDRVTVCC3VCCHALLHALL1HALL2HALL3GNDGND Figure 4 – Typical Sensor based BLDC Motor Control Application Example with MLX81207 Product Abstract TFR / CPA Page 11 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 4.4 Sensor-less BLDC Motor Control with absolute position sensing In the sample application of Figure 5, the MLX81210 is working with an absolute position sensor in order to measure the position of the gear shaft in throttle valve application systems or any other similar applications, where absolute precise position sensing is requested. Product Abstract TFR / CPA Page 12 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 4.5 Sensor-less BLDC Motor Control via a CAN-Bus-Interface In this sample application the MLX81215 can realize the sensor-less driving of a BLDC motor via a CAN-Bus Interface. System wake-up on CAN-bus traffic is possible. The 5V and a 3.3V voltage supply needed for the CAN-Bus, is generated via external N-FET control in order to limit the power dissipation in the package. The motor current can be monitored via shunt resistors in the ground and battery path in case the application requests a double side monitoring for security reasons. Application programming on module level via the CAN-Bus is supported by the SPI-Interface. Figure 6 – Typical BLDC Motor Control Application Example on the CAN-Bus with MLX81215 Product Abstract TFR / CPA Page 13 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 5. Mechanical Specification 5.1 QFN Figure 7 – QFN Drawing 5.1.1. QFN32 5x5 (32 leads) Symbol [1][2] A A1 A3 b D D2 E E2 e L N [3] ND [4] NE [4] 32 8 8 0.18 3.50 3.50 0.35 Min 0.80 0.00 QFN32 Nom 0.85 0.02 0.20 0.25 5.00 3.60 5.00 3.60 0.50 0.40 Max 0,90 0.05 0.30 3.70 3.70 0.45 Table 6 – QFN32 5x5 Package Dimensions 5.1.2. QFN48 7x7 (48 leads) Symbol [1][2] A A1 A3 b D D2 E E2 e L N [3] ND [4] NE [4] 48 12 12 0.18 5.00 5.00 0.45 Min 0.80 0 QFN48 Nom 0.85 0.02 0.20 0.25 7.00 5.10 7.00 5.10 0.50 0.50 Max 0.90 0.05 0.30 5.20 5.20 0.55 Table 7 - QFN48 7x7 Package Dimensions [1] [2] [3] [4] Dimensions and tolerances conform to ASME Y14.5M-1994 All dimensions are in Millimeters. All angels are in degrees N is the total number of terminals ND and NE refer to the number of terminals on each D and E side respectively Product Abstract TFR / CPA Page 14 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 5.2 TQFP EP 48 7x7 (48 leads) Exposed pad need best possible contact to ground for exlectrical and thermal reasons Figure 8 – TQFP EP 7x7 Drawing Min Nom Max A - - 1.20 A1 0.05 - 0.15 A2 0.95 1.00 1.05 b 0.17 0.22 0.27 b1 0.17 0.20 0.23 D 9.00 D1 7.00 D2 4.00 E 9.00 E1 7.00 E2 4.00 e 0.50 L 0.45 0.60 0.75 N 48 Ccc - - 0.08 ddd - - 0.08 Table 8 – TQFP EP 7x7 Package Dimensions Notes: 1. All Dimensioning and Tolerances conform to ASME Y14.5M-1994, ∆2. Datum Plane [-|-|-] located at Mould Parting Line and coincident with Lead, where Lead exists, plastic body at bottom of parting line. ∆3. Datum [A-B] and [-D-] to be determined at centerline between leads where leads exist, plastic body at datum plane [-|-|-] ∆4. To be determined at seating plane [-C-] ∆5. Dimensions D1 and E1 do not include Mould protrusion. Dimensions D1 and E1 do not include mould protrusion. Allowable mould protrusion is 0.254 mm on D1 and E1 dimensions. 6. 'N' is the total number of terminals ∆7. These dimensions to be determined at datum plane [-|-|-] 8. Package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package. ∆9. Dimension b does not include dam bar protrusion, allowable dam bar protrusion shall be 0.08mm total in excess of the \"b\" dimension at maximum material condition, dam bar can not be located on the lower radius of the foot. 10. Controlling dimension millimeter. 11. Maximum allowable die thickness to be assembled in this package family is 0.38mm 12. This outline conforms to JEDEC publication 95 Registration MS-026, Variation ABA, ABC & ABD. ∆13. A1 is defined as the distance from the seating plane to the lowest point of the package body. ∆14. Dimension D2 and E2 represent the size of the exposed pad. The actual dimensions are specified ion the bonding diagram, and are independent from die size. 15. Exposed pad shall be coplanar with bottom of package within 0.05. Product Abstract TFR / CPA Page 15 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 6. Marking/Order Code 6.1 Marking MLX81205/07/10/15 1 Product Abstract TFR / CPA Page 16 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 7. Assembly Information This Melexis device is classified and qualified regarding soldering technology, solder ability and moisture sensitivity level, as defined in this specification, according to following test methods: • IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification For No hermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2) • EIA/JEDEC JESD22-A113 Preconditioning of No hermetic Surface Mount Devices Prior to Reliability Testing (Reflow profiles according to table 2) • CECC00802 Standard Method For The specification of Surface Mounting Components (SMD’s) of Assessed Quality • EIA/JEDEC JESD22-B106 Resistance to soldering temperature for through-hole mounted devices • EN60749-15 Resistance to soldering temperature for through-hole mounted devices • MIL 883 Method 2003 / EIA/JEDEC JESD22-B102 Solder ability For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. Based on Melexis commitment to environmental responsibility, European legislation (Directive on the restriction of the use of certain hazardous substances, RoHS) and customer requests, Melexis has installed a roadmap to qualify their package families for lead free processes also. Various lead free generic qualifications are running, current results on request. For more information on Melexis lead free statement see quality page at our website: http://www.melexis.com/html/pdf/MLXleadfree-statement.pdf Product Abstract TFR / CPA Page 17 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 8. Disclaimer The product abstract just provides an overview of the described devices. Please consult the complete product specification/datasheet in its latest revision for any detailed information. Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other services. © Melexis NV. All rights reserved For the latest version of this document, go to our website at www.melexis.com Or for additional information contact Melexis Direct: Europe, Africa, Asia: America: Phone: +32 1367 0495 E-mail: sales_europe@melexis.com Phone: +1 248 306 5400 E-mail: sales_usa@melexis.com ISO/TS16949 and ISO14001 Certified Product Abstract TFR / CPA Page 18 of 18 Rev 3.9 11-May-2012
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