CONNECTING STRUCTURE AND PRODUCTION METHOD

专利名称：CONNECTING STRUCTURE AND

PRODUCTION METHOD

发明人：Teruyuki OHNISHI,Shinichi ISOBE,Kohtaro

SHIINO,Toru TAKAHASHI

申请号：US13283027申请日：20111027

公开号：US20120149243A1公开日：20120614

专利附图：

摘要：A connecting structure to connect electronic components electrically through aplurality of conducting lines each including a covered segment including a wire conductor

covered with an insulating covering and an uncovered segment includes a molding unitand a sealing unit. The molding unit encloses a boundary portion between the coveredsegment and the uncovered segment of each of the conducting lines so that theuncovered segments project in a first direction from a first end of the molding unit andthe covered segments project in a second direction from a second end of the moldingunit, and thereby holding the conducting lines to fix positions of the conducting linesrelative to one another. The sealing member of an adhesive adheres to the second end ofthe molding unit and adheres to each of the covered segments of the conducting linesprojecting from the second end of the molding unit.

申请人：Teruyuki OHNISHI,Shinichi ISOBE,Kohtaro SHIINO,Toru TAKAHASHI

地址：Atsugi-shi JP,Ebina-shi JP,Isehara-shi JP,Hiratsuka-shi JP

国籍：JP,JP,JP,JP

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