Injection molded printed circuits

专利名称：Injection molded printed circuits发明人：Denes, Oscar L.申请号：EP90119943.0申请日：19901018公开号：EP0424796A3公开日：19911121

专利附图：

摘要：An electrical circuit package wherein a flexible support member (11) havingconductive materials (91, 94) and electronic components thereon is fused with asubstrate (12) which acts as a support for the film. This results in a unitary packagedcircuit. In one embodiment the film is a decal on which certain portions have a substrate

fused thereto. In other embodiments, various layers of conductive materials (91, 94) areapplied and molded into the substrate (12) to form a variety of electronic functions. Thecircuit package lends itself to high production and reliability as well as cost savings.

申请人：ALLEN-BRADLEY INTERNATIONAL LIMITED

地址：45 Station Road Henley-on-Thames, Oxfordshire GB

国籍：GB

代理机构：Lippert, Hans, Dipl.-Ing.

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