专利名称：Method for forming cavity发明人：塚田 謙磁申请号：JP2020506079申请日：20180316
公开号：JPWO2019176088A1公开日：20201022
专利附图：
摘要：In an insulating resin layer of an electronic device which is made of threedimensional layered structure including an electronic component and a circuit wiringlayerWhen forming a cavity in which electronic parts are containedOn the interval fromthe top edge of the electronic component to the opening edge of the cavityThe nozzleto embed the insulating resin to fill the cavityA method of forming a cavity having a firstadjustment step for adjusting the aperture dimension of the cavity.
申请人：株式会社ＦＵＪＩ
地址：愛知県知立市山町茶碓山１９番地
国籍：JP
代理人：特許業務法人ネクスト,深津 泰隆,片岡 友希
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