专利名称：SUBSTRATE AND MANUFACTURING
METHOD OF THE SAME
发明人：Yoshiaki Shimizu申请号：US12343740申请日：20081224
公开号：US20090179305A1公开日：20090716
专利附图：
摘要：According to the present invention, on a double-sided substrate a plurality ofthrough-holes connected to one wire for plating as well as wiring are collectively
arranged within a narrow range close to the connection portion. After a plating process, a
penetrating hole is formed and the connection potion is cut off. Thus, the wire for platingand the collectively arranged through-holes are made independent of one another sothat no electric conduction occurs among the wire for plating and the through-holes
申请人：Yoshiaki Shimizu
地址：Shiga JP
国籍：JP
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容
Copyright © 2019- huatuo3.com 版权所有 蜀ICP备2023022190号-1
违法及侵权请联系：TEL:199 1889 7713 E-MAIL:2724546146@qq.com
本站由北京市万商天勤律师事务所王兴未律师提供法律服务