Label substrate, RFID tag and RFID system

专利名称：Label substrate, RFID tag and RFID system发明人：杉本 好正,山本 周一申请号：JP2018519505申请日：20171019

公开号：JPWO2018074553A1公开日：20181018

摘要：A kind of label substrate (10) etc., has: insulating substrate (1), has the uppersurface with the lower surface of external engagement and comprising recess portion(1a); Upper surface conductor (2) is arranged in the upper surface of insulating substrate(1); Earth conductor (3) is arranged in the lower surface of insulating substrate (1); Andshort perforation conductor (4), penetrate through insulating substrate (1) in a thicknessdirection, and upper surface conductor (2) and earth conductor (3) are electricallyconnected, short perforation conductor (4) is only connect in a part of the peripheralpart of upper surface conductor (2) with upper surface conductor (2).

申请人：京セラ株式会社

地址：京都府京都市伏見区竹田鳥羽殿町６番地

国籍：JP

更多信息请下载全文后查看